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Boson®+

High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module

Made in the USA, and ITAR-free, the Boson+ sets the standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness. Lower video latency enhances tracking, seeker performance, and decision support. Radiometry will be available in the third quarter of 2024 on 640 x 512 and 320 x 256 resolution models.

Boson+ maintains the widely-deployed Boson mechanical, electrical, and optical interfaces enabling a plug-and-play upgrade. New models also include factory-integrated continuous zooms lenses to streamline development and maximize performance. With customer-selectable USB, CMOS, or MIPI video interfaces, it is easier than ever to integrate Boson+ into a wider range of embedded processors from Qualcomm, Ambarella, and more. The user-friendly Boson SDK, GUI, and comprehensive product integration documentation further simplify OEM integration. Enhanced thermal performance and industry-leading reliability provide low-risk development, making Boson+ ideal for unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.

FLIR ISC9705

Mid-format readout integrated circuit (ROIC) optimized for Indium Antimonide (InSb), Type-II strained-layer superlattice (T2SLS) and Quantum Well (QWIP) infrared detectors.

The ISC9705 was the first off-the-shelf, standard multiplexer introduced to the market. Since its introduction in October 1997, detector manufacturers across the globe have purchased the ISC9705 for building infrared focal plane arrays. This high-performance, 320 × 256 pixel, 30-micron pitch readout integrated circuit is built using a submicron complementary metal-oxide-silicon (CMOS) process, delivered in 6-inch wafer form. Devices are tested and delivered to customers in wafer form with an extensive set of user documentation.

FLIR PTU-5

Pan/Tilt for top-mounted Payloads up to 5 lbs

Standing only six inches tall when fully integrated, the FLIR PTU-5 can hold up to five pounds on its top bracket, packing incredible performance into a compact package. Even with its small size the PTU-5 is more accurate than many other — more expensive — systems thanks to the absolute encoders used on the drive axes. Fully sealed and weatherproof rated to IP67, the PTU-5 can be used anywhere, even outdoors.

NOTE: Accessories not included, see options at the bottom of this page.

Boson®+ CZ 14-75

High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module

Made in the USA, and ITAR-free, the Boson+ CZ 14-75 combines Teledyne FLIR’s Boson+ world-class longwave infrared (LWIR) OEM camera module and 5x continuous zoom (CZ) lens offering a high–performance imaging solution. It features an industry-leading thermal sensitivity of ≤20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness. The high-performance lens and control electronics maintain focus through zoom and provide real-time thermal gradient compensation as well as flexibility for user-defined command syntax and expansion for additional features.

The Boson+ camera module and 14 mm to 75 mm CZ lens are designed for each other, providing optimal performance and a single system warranty only achievable from a single source. The factory-integrated system lowers development and manufacturing risk and improves time-to-market, making the reliable Boson+ CZ 14-75 ideal for unmanned aerial vehicles, perimeter surveillance, light armored vehicle situational awareness and targeting, and soldier sighting systems.

Boson®

Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module

The Boson longwave infrared (LWIR) OEM thermal camera module sets the standard for size, weight, power, and performance (SWaP). Utilizing FLIR's advanced image processing and several industry-standard communication interfaces, Boson enables applications from firefighting to unmanned aerial vehicles and automotive development kits, all for as little as 800mW. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 × 512 or 320 × 256. Both resolutions are available with multiple lens configurations, adding flexibility to integration programs. Radiometric models are also available with absolute temperature measurement in select configurations. The Boson is an OEM camera module that is intended to be integrated into a higher level system.

FLIR ISC9809

Mid-format readout integrated circuit (ROIC) optimized for Indium Gallium Arsenide (InGaAs) infrared detectors

The ISC9809 is a 320 × 256 format, 30-micron pitch ROIC, specifically designed for low background applications. A CTIA front end circuit is used and the readout noise in the high gain mode is less than 70 electrons. This mid-format ROIC supports the same advanced features as the other standard ROICs, snapshot mode, adjustable integration time and gain, skimming, power and current adjustments, and additionally supports selectable integration capacitors (0.17M or 3.5M electrons).

FLIR PTU E46

Miniature Computer-Controlled Pan/Tilt Unit

The PTU-E46 family of miniature pan/tilt units provide fast, precise positioning in an extremely small and lightweight package. They are fully computer-controlled and offer programmability of speed, acceleration, power, and other parameters. The included controller, with built-in RS-232, Ethernet, and RS-485 interfaces, handles precise kinematic motion control according to user-set parameters. The PTU-E46 units accept ASCII and binary command formats and is networkable. Commands can be sent at high speeds for demanding applications, such as laser scanning and video tracking.

The PTU-E46 series will discontinue on March 1, 2024. The last day of support from Teledyne FLIR will be June 2025. For more information regarding the discontinuation process and to see what alternative solutions we recommend, please reference the EOL notice below.

Spinnaker SDK

Reliable GigE Architecture, Exceptional Performance.

The Spinnaker SDK is FLIR’s next generation GenICam3 API library built for machine vision developers. It features an intuitive GUI called SpinView, rich example code, and comprehensive documentation designed to help you build your application faster. The Spinnaker SDK supports FLIR USB3, 10GigE, and most GigE area scan cameras. Supported platforms: Windows / Linux Ubuntu / MacOS

Blackfly S USB3

Ultra-compact form

The Blackfly® S leverages the industry’s most advanced sensors in an ice-cube form factor. It is packed with powerful features enabling you to easily produce the exact images you need and accelerate your application development. This includes both automatic and precise manual control over image capture and on-camera pre-processing. The Blackfly S is available in GigE, USB3, cased, and board-level versions.

The Blackfly S currently has a lead time of four weeks or less. Get the cameras you need – when you need them.

FLIR ISC0903

Mid-format, two-color, dual polarity readout integrated circuit (ROIC) optimized for Indium Antimonide (InSb), Type-II strained-layer superlattice (T2SLS) and Quantum Well (QWIP) infrared detectors.

The ISC0903 is a 320 × 256 format, 30-micron pitch, two-color, dual polarity ROIC. It is designed for use with p-on-n or n-on-p detectors such as strained-layer superlattice devices. It is based on the ISC9705 so the pixel pitch is identical and interface is similar. The ROIC has been specifically designed to allow for both polarities of detectors to be placed back-to-back and to connect to the ROIC through the one input pad to obtain a two-color image.

FLIR PTU-D48E

Pan/Tilt Unit for side-mounted payloads up to 15 lbs

The PTU-D48 E-Series supports any type of single or multi-part payload through a flexible bracketing system of top and/or side mounting. The real-time command interface supports advanced applications such as video tracking. The PTU-D48 E-Series has been proven in a wide range of mission-critical applications for positioning of cameras, lasers, antennas, or other instruments in both fixed and mobile environments. It is designed for high duty cycles and reliable operation 24/7 in harsh all-weather environments.

Lepton®

LWIR Micro Thermal Camera Module

The FLIR Lepton® is a radiometric-capable LWIR OEM camera solution that is smaller than a dime, fits inside a smartphone, and is one tenth the cost of traditional IR cameras. Using focal plane arrays of either 160x120 or 80x60 active pixels, Lepton easily integrates into native mobile-devices and other electronics as an IR sensor or thermal imager. The radiometric Lepton captures accurate, calibrated, and noncontact temperature data in every pixel of each image.

FLIR ISC0208

European format readout integrated circuit (ROIC) optimized for Indium Antimonide (InSb) and Quantum well infrared detectors

The ISC0208 is a high-performance, European format, 384 × 288 format, 25-micron pitch readout integrated circuit. Two versions are available, -1 with a 18M electron well capacity designed for use with QWIP detectors and -2 with a 13M electron well capacity for InSb detectors. The ISC0208 is built using a submicron complementary metal-oxide-silicon process. Devices are typically delivered in 6-inch wafer form with extensive user documentation and test data included with each delivery.

FLIR PTU-D100EX

Pan/Tilt Unit for side-mounted payloads up to 25 lbs

The PTU-D100 E-Series supports any type of single or multi-part payload through a flexible bracketing system of top and/or side mounting. It has been designed to be simple to integrate. The PTU-D100 E-Series is an open platform that provides the flexibility needed while minimizing your development and integration effort. It has been proven in a wide range of mission-critical applications for positioning of cameras, lasers, antennas, or other instruments in both fixed and mobile environments.

Neutrino®

Midwave Infrared Cooled Camera Module

Where SWaP are design constraints, and cost and performance is desired, Neutrino® is the ideal solution. The Neutrino offers FLIR'scommon image processing architecture and the resulting image from the 640×512 InSb array is superb! Weighing in at less than 16 oz (<450 gm) and consuming less than 5 watts at steady-state, it is FLIR's balanced MWIR core optimizing performance, cost, and ease of integration.

Tau® 2+

Longwave Infrared Thermal Camera Module with Enhanced Performance and Increased Sensitivity

Made in USA, and ITAR-free, the Tau 2+ is the most advanced, highest performance longwave infrared (LWIR) Tau 2 camera model from Teledyne FLIR. It maintains the widely deployed and real-world-tested Tau 2 mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. Its new 1.5× sensitivity improvement and an entirely redesigned image processing engine deliver dramatically enhanced scene contrast and sharpness.

Tau 2+ is the go-to thermal camera module for the most challenging environments, including detection of the smallest, hardest to find targets over long distances. Enhanced LWIR thermal performance and market-leading reliability provide low-risk development in the short run and the long run, making it the ideal camera module for unmanned vehicles, security applications, and thermal sights.

The Tau2+ is an OEM camera module that is intended to be integrated into a higher level system.

FLIR ISC0402

Large format readout integrated circuit (ROIC) optimized for Indium Antimonide (InSb) and Quantum well infrared detectors

The ISC0402 is 640 × 512 format, 20-micron pixel ROIC. It’s compatible with P-on-N detectors such as InSb, QWIP, InGaAs, and MCT. It offers the same advanced features as our other standard designs including windowing, adjustable gain, interlaced/non-interlaced readout, power adjustment, and multiple output channels. Two versions of the design are available with different size integration capacitors 3.5M electrons for the smaller well and >6M electrons for the large well version.

FLIR PTU-D300E

Pan/Tilt Unit for side-mounted payloads up to 70 lbs

The PTU-D300 E-Series supports any type of single or multi-part payload through a flexible bracketing system of top and/or side mounting. Easy to integrate, the PTU-D300 E-Series is an open platform that provides the flexibility needed while minimizing your development and integration effort. The PTU-D300 E-Series has been proven in a wide range of mission critical applications for positioning of cameras, lasers, antennas, or other instruments in both fixed and mobile environments.

Mini-Core HRC

Midwave Infrared (MWIR) Cooled Camera Module

The FLIR Mini-Core HRC mid-wave camera core is available in multiple configurations, making it extremely OEM-friendly. 300Z comes with continuous optical zoom; 460T comes with three lenses that are instantaneously remotely interchangeable depending on whether you need to see far, middle distance or near; if your application calls for a consistent field of view, then you can select fixed, interchangeable lenses; or, you can select a lens-less core wherein you implement your own optical path.

Tau® 2

Longwave Infrared Thermal Camera Module

Made in USA, the Tau® 2 OEM thermal imaging cameras offer an unmatched combination of features and reliability, making them well-suited for demanding applications including unmanned vehicles, thermal sights, and handheld imagers. Improved electronics provide powerful image processing modes that dramatically improve detail and contrast through continuous histogram equalization. Radiometry is available in every pixel for both 640 × 512 and 336 × 256 resolutions and all three camera grade levels. All Tau 2 configurations share electrical, mechanical, and optical interfaces allowing integrations to be designed that work seamlessly with all formats. Available in Commercial, Performance, and Industrial variants, each with unique sensitivity and pixel operability thresholds to meet operational requirements. Radiometry is an optional feature for Performance-grade cameras, and standard feature with Industrial-grade. All Tau 2 configurations and resolutions share electrical, mechanical, and optical interfaces allowing integrations to be designed that work seamlessly with all formats.

Dragonfly S USB3

Test, Develop and Deploy at Speed

Dragonfly® S is a first of its kind, practical option for industries ranging from life science instrumentation to factory automation. The modular, compact, and lightweight design accelerates the inception stage of imaging application development for at-scale manufacturing, volume-based applications, and multi-camera systems. Paired with sensor options from Sony, onsemi and Teledyne e2v, Dragonfly® S is ideal for embedded or handheld device applications such as biometrics kiosk solutions, ophthalmoscopy, 3D scanning, automated optical inspection, and more.


Dragonfly S will be shipping in Q3 2024

FLIR ISC0403

Large format readout integrated circuit (ROIC) optimized for Indium Antimonide (InSb) and Type-II strained-layer superlattice (T2SLS) infrared detectors

The ISC0403 is a 640 × 512 format ROIC with a 15-micron pixel pitch. Used with P-on-N detectors, this ROIC offers the same advanced features as our other standard designs including windowing, adjustable gain, snapshot integration integrate-then-read and integrate-while-read modes, power adjustment, and multiple output channels allowing data rates of up to 120 frames/sec for full frame operation and 2054 frames/sec for small window sizes. The charge capacity is >6.5M electrons and the bias adjustment is 600mV.

Hadron 640 Series

High Performance, Dual Thermal and Visible OEM Camera Module

The ITAR-free Hadron™ 640 series pairs a 64MP visible camera with a performance-leading 640x512 resolution radiometric Boson® or Boson+ thermal camera in a single easy-to-integrate module. With a size, weight, and power (SWaP) optimized design, it is an ideal dual sensor payload for integration into unmanned aircraft systems (UAS), unmanned ground vehicles (UGV), robotic platforms, and emerging AI applications utilizing Teledyne FLIR Prism™ software.

Hadron 640 models share mechanical and electrical interfaces simplifying design. Compatible with Teledyne FLIR’s Prism AI detection, tracking, and classification models and Prism ISP libraries for super-resolution, turbulence mitigation, contrast enhancement, and more, Hadron 640 series enables effective AI-based applications. With drivers available for market leading processors from NVIDIA®, Qualcomm®, and more plus industry-leading integration support, Hadron 640 also reduces development cost and shortens time to market.

Evaluate Prism with the Hadron 640R using the Prism Development Kit for Qualcomm RB5 today.

PTU-D300E-HS

Pan/Tilt Unit for side-mounted payloads up to 40 lbs